Semiconductors & Electronics Clear all
China PCB Substrate CCL Copper Clad Laminate 2026 — From General FR-4 to High-Frequency, High-Speed and Package Substrate Breakthroughs
Deep research on the global CCL copper clad laminate market in 2026: AI server-driven high-speed CCL boom, Shengyi M9 NVIDIA certification breakthrough, ABF substrate supply gaps, domestic substitution tiers and M&A landscape.
China's Industrial Tape 2026 — The Localization Climb from Release Films to High-End OLED Membrane Materials
A systematic review of China's industrial tape industry covering PSA tape, release films, OCA optical adhesives, and OLED process films — mapping the supply chain, competitive landscape, domestic substitution trajectory, and structural opportunities through 2028.
China EDA Software Industry 2026 — From Synopsys Triopoly to the Domestic Trio of Empyrean, Primarius & Broadway Tech
A comprehensive analysis of the global EDA triopoly's dominance, the technical roadmaps and financials of China's leading domestic EDA companies (Empyrean, Primarius, Broadway Tech, Xinyuazhang), the impact of US export controls, Big Fund III catalysis, AI-EDA trends, and the realistic progress of domestic substitution with a 2030 outlook.
China Semiconductor Photoresist 2026 — A Five-Generation Climb from i-line, KrF, ArF to EUV
A comprehensive deep dive into China's semiconductor photoresist industry: five-generation technology evolution (g-line/i-line/KrF/ArF/EUV), Japan's global monopoly, domestic breakthroughs by Nanda Optoelectronics, Tongcheng/Beijing Kechuang, and peers, plus the 2026 localization roadmap and risk assessment.
China Machine Vision Core Components 2026 — Localization Map for Industrial Cameras, Lenses, Light Sources, and Frame Grabbers
A comprehensive 2026 analysis of China machine vision core components—industrial cameras, optical lenses, LED light sources, frame grabbers, and 3D vision modules—covering market sizing, a four-tier localization map, key players, and technology trends across the full supply chain.
China Electronic Specialty Gases 2026 — Semiconductor Localization Breakthrough at the Critical Chokepoint
Electronic specialty gases are strategic consumables in semiconductor manufacturing, with prices multiples of gold by weight. In 2026, two major Japanese WF6 suppliers permanently exited due to China's tungsten export controls, handing China the fastest single-category global share restructuring in ESG history. This report covers NF3/WF6/SiH4 category dynamics, 8 A-share listed companies, three-tier localization progress, and a 5-year trend analysis anchored to June 18, 2026.
2026 China Semiconductor Materials Industry (Silicon Wafers + Photoresist + Electronic Chemicals + Targets + CMP + Photomasks): Market Size and Competitive Landscape Deep Research Report
Semiconductors are called the "oil" of modern industry, yet the true bottleneck rarely sits with the chips themselves — it lies in the ultra-pure materials that make chip fabrication possible. Silicon wafers, photoresists, electronic chemicals, sputtering targets, CMP polishing materials, photomasks, and packaging substrates: each of these sub-sectors has its own technological barriers, and each is a battlefield where Chinese industry is pushing hard for domestic substitution.
2026 China Power Semiconductor Market Scale and Competitive Landscape: Deep Research Report
2025 global power semiconductor market ~USD 60B; China ~USD 25B (42%). Automotive IGBT domestic rate ~67%; Tianyue Advanced SiC substrates global #1 (27.6%); Wolfspeed bankruptcy; Starpower revenue RMB 4B; Innoscience GaN enters Nvidia supply chain. Triple drivers: NEV 800V SiC + PV IGBT + energy storage PCS.
2026 China MCU Microcontroller Industry: Market Size and Competitive Landscape Deep Research Report
Global MCU market in 2025 approximately US8 billion; ST/NXP/Microchip/Renesas/Infineon/TI six giants hold 80% globally. China MCU market approximately RMB 35 billion, 32-bit exceeding 70% share, domestic localization rate approximately 20%, automotive-grade under 5%. GigaDevice GD32 cumulative shipments exceed 2 billion units, Espressif ESP32 global Wi-Fi MCU share over 30%; automotive-grade localization is the deepest moat, RISC-V + AI MCU is the next battle.
2026 China Semiconductor Packaging and Test (OSAT) Industry: Market Size and Competitive Landscape Deep Research Report
The global OSAT market reached ~USD 48B in 2025. Mainland China holds ~30% of global capacity, forming the "Second Pole" alongside Taiwan. JCET ranks global 3rd, Tongfu 4th, Huatian 6th — together ~22-24% of global OSAT. Yet in CoWoS/HBM advanced packaging, mainland localization is under 5%. This report maps the global OSAT landscape, sub-segment localization rates, advanced packaging gaps, and equipment controls, with a 2026-2030 forecast.
2026 China Third-Generation Semiconductor (SiC/GaN) Substrate and Device Industry: Market Size and Competitive Landscape Deep Research Report
In 2025, China's SiC substrate capacity ranks No.1 globally; Tianyue Advanced leads conductive SiC substrates with 27.6% global share and 51.3% of 8-inch SiC; Innoscience's GaN power devices turn gross-margin positive for the first time; and Wolfspeed's bankruptcy restructuring reshapes global supply. This deep-dive covers China's complete third-generation semiconductor supply chain, FY2025 enterprise data, the 8-inch SiC technology roadmap, and 2026-2030 market forecasts.
Smartphones: China's Global Contest for the Palm of Your Hand (2026 Deep Research Report)
In 2025, more than one in every two smartphones sold globally came from a Chinese brand. Huawei reclaimed China's top shipment position for the first time in five years; Apple set an all-time iPhone shipment record; foldable screen penetration surpassed 3%; and on-device AI large language models became the new standard on flagship handsets. This is a systematic study of the structure, technology, and future trajectory of China's smartphone industry.