天下工厂产业研究院 天下工厂产业研究院

Industry

Industry Reports

Deep research one industry at a time: market size, supply chain, competitive landscape, segments, technology trajectory, risks and forecasts. Every report cross-references public trade-association data with verified factory samples identified by Tianxia Gongchang.

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Research Report

China Tungsten and Molybdenum Alloys 2026: Strategic Metals Across Cemented Carbide, Photovoltaic Tungsten Wire and High-end Equipment

A comprehensive analysis of China's tungsten-molybdenum alloys chain — from Jiangxi-Hunan tungsten and Henan-Shaanxi molybdenum, through APT/W-powder/cemented-carbide midstream, covering FY2025 results of China Tungsten & Hightech, Xiamen Tungsten, CMOC, Jinduicheng Molybdenum, Zhangyuan Tungsten with Sandvik/Plansee/Kennametal benchmarks, the APT price doubling to RMB 780K/ton, the Feb 2025 export controls, four emerging downstream applications, and five structural judgments for 2026-2030.

Research Report

2026 China Phosphate Chemicals: From Phosphate Rock to LFP Cathode — Industrial Chain Integration

Deep research on the 2026 China phosphate chemicals industry: covering rock, yellow phosphorus, industrial phosphoric acid, iron phosphate, LFP cathode, glyphosate, and fertilizer; analyzing Yuntianhua, Xingfa, Hubei Yihua, Chuanfa Longmang, Chuanheng vs OCP, Mosaic, Nutrien, PhosAgro, EuroChem; five structural shifts 2026-2030: integration, mining rights, new energy, green low-carbon, China-Morocco duality.

Research Report

China Polysilicon 2026 — Top-Tier Cost Discipline and the N-Type Granular Breakthrough

Deep 2026 research on China polysilicon: 3.2M tonnes capacity vs 1.1M demand (2.9x oversupply); prices crashed from RMB 300K to 40K/tonne; Tongwei, GCL, Daqo, Xinte, Asia Silicon vs Wacker, Hemlock, OCI in N-type era; granular share rises to 24%; USD 5B integration fund; Oman/Indonesia/Malaysia overseas bases; EU CBAM and green silicon; 'four-plus-two' 2030 forecast.

Research Report

China Memory Chip 2026: DRAM, NAND Twin Breakthrough and HBM On-Board

A full-landscape research on China memory chip industry 2026 — YMTC NAND, CXMT DRAM, domestic HBM, and module ecosystem advancing in parallel; generation gap and breakthrough paths versus SK Hynix, Samsung, Micron, Kioxia. Fourteen chapters of in-depth analysis.

Research Report

China Wafer Foundry 2026: Mature-Node Expansion Wave and Advanced-Node Breakthrough

In 2025 mainland China wafer foundry approached RMB 200B revenue, 1.2M 12-inch wpm, utilization 90%+; SMIC's USD 9.3B revenue lifted it to global #2; N+2/N+3 serves Huawei Kirin and Ascend. This 14-chapter report covers industry overview, node breakdown, process barriers, key players, capacity, advanced-node breakthrough, supply chain, price war, capex, policy, customer structure, scenarios and risks.

Research Report

China Integrated Die-Casting 2026: The 9000T Mega-Press Wave and NEV Body Reconstruction

In 2025 China integrated die-casting structural-parts market crossed thirty billion yuan; close to twenty 9,000-ton mega presses now installed; 16,000-ton class running at XPeng P7+ and Hongtu Guangzhou. A 14-chapter picture from heat-treatment-free alloy, mega molds, mega presses to Tier1 casters and OEM programs — localization milestones, the economic argument, insurance and crash dynamics, and the five-year landscape evolution.

Research Report

China Fluorochemicals 2026 — Refrigerant Quotas Capped and the Fluorinated New-Materials Breakthrough

Fluorochemicals connects fluorspar mines to new-energy, semiconductors, hydrogen, and home appliances. After China's 2024 HFC quota system, R32 rose 4x to 110,000 yuan/ton; meanwhile fluoropolymers (PTFE/PVDF/FKM) and electronic fluorochemicals (LiPF6, EG-HF, PFSA membrane) are breaking through. Covers fluorspar resources, refrigerant generations, eight players, quota dynamics, new materials, policy, and 3-5 year outlook.

Research Report

China High-End Connectors 2026 — Domestic Breakthrough Driven by AI Servers and EV Powertrains

In 2026, China's high-end connector industry stands at a historic inflection point: NVIDIA GB200/GB300 AI computing rack 224G high-speed interconnect demand, 800V EV liquid-cooled high-voltage connector deployment at scale, and defense procurement recovery are collectively accelerating domestic substitution from consumer electronics into premium connector segments. This report covers 14 dimensions and presents three core judgments and a systemic risk framework.

Research Report

China CNC Controller 2026 — The Domestic Substitution Battle for the Industrial Mother Machine Brain

An in-depth analysis of China CNC system market in 2026: technology tiers, leading players, domestic substitution progress, AI-enabling trends across 14 key themes.

Research Report

China High-Purity Metal Sputtering Targets 2026 — Domestic Breakthrough from Semiconductor Cu/Al Targets to Display ITO

Sputtering targets are the core PVD consumables for semiconductor, display, and photovoltaic manufacturing. This report systematically analyzes the global landscape, domestic substitution progress, and competitive positioning of key players across Cu, Al, Ta, W, Ru, and ITO categories, anchored to the latest 2026 data.

Research Report

China Semiconductor CMP Pad and Slurry 2026 — From DuPont Monopoly to Dual Domestic Substitution by Dinglong and Anji

A comprehensive 2026 analysis of China's semiconductor CMP polishing pad and slurry industry: DuPont's global dominance, Dinglong and Anji Microelectronics' domestic substitution progress, SiC CMP emerging markets, policy tailwinds, and investment outlook. Data current through June 20, 2026.

Research Report

China Collaborative Robot 2026 — From JAKA and Dobot to ABB Yumi, A New Human-Robot Co-Line Industrial Order

A comprehensive 2026 research report on China's collaborative robot industry. Covering market landscape, core technologies, supply chain, applications, key players, domestic substitution trends, investment, and research judgments based on data from 4.8 million verified factories.