天下工厂产业研究院 天下工厂产业研究院

[ SERIES ]

Semiconductors & Electronics

The full chain from design through fabrication, packaging and test to materials and equipment, plus displays, optical modules, connectors and the localisation race across electronics.

Part 1

China PCB Industry 2026: Market Size and Competitive Landscape — In-Depth Research Report

— Tianxia Gongchang Research

Part 2

China MLCC and Passive Components: Market Scale and Competitive Landscape Research Report 2026

— Tianxia Gongchang Research

Part 3

China Semiconductor Equipment Market 2026: Scale, Competition, and Localization Roadmap

— Tianxia Gongchang Research

Part 4

2026 China Optical Transceiver Industry: Market Size and Competitive Landscape Research Report

— Tianxia Gongchang Research

Part 5

2026 China Display Panel Industry: Market Scale and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 6

2026 China CMOS Image Sensor (CIS) Industry Market Scale and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 7

Apple Chain Reshaping and the AI Hardware Boom: China Consumer Electronics Foundry Deep Research Report 2026

— Tianxia Gongchang Research

Part 8

China IC Design Industry: Market Size, Competitive Landscape, and In-Depth Research Report 2026

— Tianxia Gongchang Research

Part 9

The Sub-RMB-1500 Inflection: 2026 Deep Research Report on China LiDAR Industry Market Size and Competitive Landscape

— Tianxia Gongchang Research

Part 10

Smartphones: China's Global Contest for the Palm of Your Hand (2026 Deep Research Report)

— Tianxia Gongchang Research

Part 11

2026 China Third-Generation Semiconductor (SiC/GaN) Substrate and Device Industry: Market Size and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 12

2026 China Semiconductor Packaging and Test (OSAT) Industry: Market Size and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 13

2026 China MCU Microcontroller Industry: Market Size and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 14

2026 China Power Semiconductor Market Scale and Competitive Landscape: Deep Research Report

— Tianxia Gongchang Research

Part 15

2026 China Semiconductor Materials Industry (Silicon Wafers + Photoresist + Electronic Chemicals + Targets + CMP + Photomasks): Market Size and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 16

China Electronic Specialty Gases 2026 — Semiconductor Localization Breakthrough at the Critical Chokepoint

— Tianxia Gongchang Research

Part 17

China Machine Vision Core Components 2026 — Localization Map for Industrial Cameras, Lenses, Light Sources, and Frame Grabbers

— Tianxia Gongchang Research

Part 18

China Semiconductor Photoresist 2026 — A Five-Generation Climb from i-line, KrF, ArF to EUV

— Tianxia Gongchang Research

Part 19

China EDA Software Industry 2026 — From Synopsys Triopoly to the Domestic Trio of Empyrean, Primarius & Broadway Tech

— Tianxia Gongchang Research

Part 20

China's Industrial Tape 2026 — The Localization Climb from Release Films to High-End OLED Membrane Materials

— Tianxia Gongchang Research

Part 21

China PCB Substrate CCL Copper Clad Laminate 2026 — From General FR-4 to High-Frequency, High-Speed and Package Substrate Breakthroughs

— Tianxia Gongchang Research

Part 22

China MEMS Sensors 2026 — From Consumer Acoustics to Industrial Inertia: A Dual-Track Domestic Breakthrough

— Tianxia Gongchang Research

Part 23

China Electronic-Grade High-Purity Silicon Chemicals 2026 — Closing the Loop on TEOS, HMDS and Polysilicon Precursors

— Tianxia Gongchang Research

Part 24

China Machine Vision Algorithm SDK 2026 — From HALCON Dominance to VisionMaster's Domestic Rise

— Tianxia Gongchang Research

Part 25

China Semiconductor CMP Pad and Slurry 2026 — From DuPont Monopoly to Dual Domestic Substitution by Dinglong and Anji

— Tianxia Gongchang Research

Part 26

China High-Purity Metal Sputtering Targets 2026 — Domestic Breakthrough from Semiconductor Cu/Al Targets to Display ITO

— Tianxia Gongchang Research

Part 27

China High-End Connectors 2026 — Domestic Breakthrough Driven by AI Servers and EV Powertrains

— Tianxia Gongchang Research

Part 28

China Wafer Foundry 2026: Mature-Node Expansion Wave and Advanced-Node Breakthrough

— Tianxia Gongchang Research

Part 29

China Memory Chip 2026: DRAM, NAND Twin Breakthrough and HBM On-Board

— Tianxia Gongchang Research

Part 30

China Semiconductor Silicon Wafer 2026 — The 300mm Localization Push

— Tianxia Gongchang Research

Part 31

China Semiconductor Test Equipment 2026: SoC ATE and Probe Station Localization Push - Market Size and Competitive Landscape Deep Research Report

— Tianxia Gongchang Research

Part 32

2026 China PCB Equipment Industry: Market Size & Localization Substitution

— Tianxia Gongchang Research

Part 33

China's Display Panel Industry 2026: From 'Screen Famine' to Global Dominance—A Counter-Cyclical Comeback and the Last Fortresses at the High End

— Tianxia Gongchang Research